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GIGABYTE B660 AORUS MASTER DDR4 (rev. 1.0)
GIGABYTE B660 AORUS MASTER DDR4 (rev. 1.0)
Rs. 22,815.00
Rs. 17,550.00
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GIGABYTE B660 AORUS MASTER DDR4 (rev. 1.0)
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PERFORMANCE UNLEASHED
Rule supreme with the B660 AORUS gaming motherboards. The new king of gaming platform continues the legendary AORUS bloodline with the most robust power delivery and dominant thermal design, glorified with the complete memory overclocking technology to crown your PC with the best Alder Lake's performance in all its gaming glory.
Unparalleled Performance
With technology moving so fast, GIGABYTE still keep up with the latest trends and provide our customers with advanced features and latest technology. GIGABYTE B660 Series motherboards come with upgraded power solution, latest storage standards and outstanding connectivity to enable optimize performance for gaming.
Twin Hybrid VRM Design
To ensure maximum Turbo Boost and performance of Intel new generation CPU, GIGABYTE B660 equips the best VRM design we’ve ever built with the highest quality components.
DDR4 XMP
Support for DDR4 XMP Up to 5333MHz and Beyond*
AORUS is offering a tested and proven platform that ensures proper compatibility with profiles up to 5333MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their AORUS motherboard.
3 x PCIe 4.0/3.0 x4 M.2
Triple PCIe 4.0/3.0 x4 M.2 Connectors with Thermal Guard
AORUS Gaming Motherboards are focused on delivering M.2 technology to enthusiasts who want to maximize their Systems' potential.
Hybrid Cores Optimization
With new Intel Hybrid technology, GIGABYTE exclusively creates two new "CPU Upgrade" in BIOS profiles to meet different users’ scenarios by adjusting P-Core and E-Core activation and voltage policy.
ADVANCED THERMAL SOLUTION
GIGABYTE B660 Series Motherboards' Un-throttled performance is guaranteed by innovative and optimized thermal design to ensure the best CPU, Chipset, SSD stability and low temperatures under full load application and gaming.Fully Covered MOSFET Heatsink
1. 2X Large Surface Increased surface area up to 2X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs. 2. Real One-piece Build TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors’ multi-piece design. 3. Multi-Cut Design TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through which leads to a great improvement of the heat transfer performance.AORUS M.2 Thermal Guard
With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.2X copper PCB Design
By adopting 2X copper on PCB inner layer, it lowers the components' temperature at least 3% by turning the PCB into a super thin PCB size copper heatsink to dissipate the heat from the components effectively, due to it’s high thermal conductivity and lower impedance.SMART FAN 6
Smart Fan 6 contains several unique cooling features that ensure gaming PC maintain its performance while staying cool and quiet. Multiple fan headers can support PWM/DC fan and pump, and users can easily define each fan curve based on different temperature sensors across the board via intuitive user interface. Headers & Sensors
8 PWM/DC Fan Headers
7 Internal Temperature Sensors
2 External Temperature Sensor Cables
1 Noise Detection Cable
CONNECTIVITY
GIGABYTE B660 Series Motherboards let you experience ultimate connection flexibility and blazing data-transfer speed with next generation network, storage, and WIFI connectivity.
Personalization
GIGABYTE motherboards bundle several useful and intuitive software to help users to control every aspect of motherboard and provide customizable lighting effect with outstanding aesthetics to fit your unique personality.
ULTRA DURABLE
GIGABYTE Ultra Durable™ features its product durability and high-quality manufacturing process. GIGABYTE motherboards use the best components and reinforce every slots to make each of them solid and durable.
SPECIFICATIONS :
CPU | LGA1700 socket: Support for 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors* |
L3 cache varies with CPU | |
Please refer to "CPU Support List" for more information. | |
Chipset | Intel® B660 Express Chipset |
Memory | Support for DDR4 5333(O.C.)/ DDR4 5133(O.C.)/DDR4 5000(O.C.)/4933(O.C.)/4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200/3000/2933/2666/2400/2133 MHz memory modules |
4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory | |
Dual channel memory architecture | |
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) | |
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules | |
Support for Extreme Memory Profile (XMP) memory modules | |
(Please refer "Memory Support List" for more information.) | |
Onboard Graphics | Integrated Graphics Processor-Intel® HD Graphics support: |
1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz | |
* Support for DisplayPort 1.2 version and HDCP 2.3 | |
1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz | |
* Support for HDMI 2.1 version and HDCP 2.3. | |
** Support native HDMI 2.1 TMDS compatible ports | |
(Graphics specifications may vary depending on CPU support.) | |
Audio | Realtek® ALC1220-VB CODEC |
* The back panel line out jack supports DSD audio. | |
High Definition Audio | |
2/4/5.1/7.1-channel | |
Support for S/PDIF Out | |
LAN | Intel® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps) |
Wireless Communication module | WIFI Module |
WIFI a, b, g, n, ac, ax, supporting 2.4/5 GHz Dual-Band | |
BLUETOOTH 5.2 | |
Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate | |
* Actual data rate may vary depending on environment and equipment. | |
Expansion Slots | 1 x PCI Express x16 slot, running at x16 (PCIEX16) |
(The PCIEX16 slot conforms to PCI Express 4.0 standard.) | |
1 x PCI Express x16 slot, running at x4 (PCIEX4) | |
* The PCIEX4 slot shares bandwidth with the M2M_SB connector. The PCIEX4 slot becomes unavailable when a device is installed in the M2M_SB connector. | |
1 x PCI Express x16 slot, running at x1 (PCIEX1) | |
(The PCIEX4 and PCIEX1 slots conform to PCI Express 3.0 standard.) | |
Multi-Graphics Technology | Support for AMD Quad-GPU CrossFire™ and 2-Way AMD CrossFire™ technologies |
Storage Interface | CPU: |
1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 4.0 x4/x2 SSD support) (M2A_CPU) | |
Chipset: | |
1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 4.0 x4/x2 SSD support) (M2P_SB) | |
1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 3.0 x4/x2 SSD support) (M2M_SB) | |
4 x SATA 6Gb/s connectors | |
Support for SATA RAID 0, RAID 1, RAID 5, and RAID 10 | |
Intel® Optane™ Memory Ready | |
* System acceleration with Intel® Optane™ Memory can only be enabled on the M.2 connectors supported by the Chipset. | |
USB | Chipset: |
1 x USB Type-C® port on the back panel, with USB 3.2 Gen 2x2 support | |
1 x USB Type-C® port with USB 3.2 Gen 2 support, available through the internal USB header | |
1 x USB 3.2 Gen 1 port on the back panel | |
4 x USB 2.0/1.1 ports available through the internal USB headers | |
Chipset+2 USB 3.2 Gen 1 Hubs: | |
6 x USB 3.2 Gen 1 ports (4 ports on the back panel, 2 ports available through the internal USB header) | |
Chipset+USB 2.0 Hub: | |
4 x USB 2.0/1.1 ports on the back panel | |
Internal I/O Connectors | 1 x 24-pin ATX main power connector |
1 x 8-pin ATX 12V power connector | |
1 x 4-pin ATX 12V power connector | |
1 x CPU fan header | |
1 x water cooling CPU fan header | |
4 x system fan headers | |
2 x system fan/water cooling pump headers | |
2 x addressable LED strip headers | |
2 x RGB LED strip headers | |
3 x M.2 Socket 3 connectors | |
4 x SATA 6Gb/s connectors | |
1 x front panel header | |
1 x front panel audio header | |
1 x USB Type-C® header, with USB 3.2 Gen 2 support | |
1 x USB 3.2 Gen 1 header | |
2 x USB 2.0/1.1 headers | |
1 x noise detection header | |
2 x Thunderbolt™ add-in card connectors | |
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only) | |
1 x reset button | |
1 x Q-Flash Plus button | |
1 x reset jumper | |
2 x temperature sensor headers | |
1 x Clear CMOS jumper | |
Back Panel Connectors | 1 x USB Type-C® port, with USB 3.2 Gen 2x2 support |
5 x USB 3.2 Gen 1 ports | |
4 x USB 2.0/1.1 ports | |
2 x SMA antenna connectors (2T2R) | |
1 x DisplayPort | |
1 x HDMI 2.0 port | |
1 x RJ-45 port | |
1 x optical S/PDIF Out connector | |
5 x audio jacks | |
I/O Controller | iTE® I/O Controller Chip |
H/W Monitoring | Voltage detection |
Temperature detection | |
Fan speed detection | |
Water cooling flow rate detection | |
Fan fail warning | |
Fan speed control | |
* Whether the fan (pump) speed control function is supported will depend on the fan (pump) you install. | |
Noise detection | |
BIOS | 1 x 256 Mbit flash |
Use of licensed AMI UEFI BIOS | |
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 | |
Unique Features | Support for APP Center |
* Available applications in APP Center may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications. | |
@BIOS | |
EasyTune | |
Fast Boot | |
Game Boost | |
ON/OFF Charge | |
RGB Fusion | |
Smart Backup | |
System Information Viewer | |
Support for Q-Flash Plus | |
Support for Q-Flash | |
Support for Xpress Install | |
Bundled Software | Norton® Internet Security (OEM version) |
cFosSpeed | |
Operating System | Support for Windows 11 64-bit |
Support for Windows 10 64-bit | |
Form Factor | ATX Form Factor; 30.5cm x 24.4cm |
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